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| Home>Research>Adhesives |
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| k. Development of room temperature setting sealants for panel edges |
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| Suitable room temperature setting pehnolic based sealant compositions were developed and introduced in the industry successfully. |
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| l. Putty for repair of plywood |
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| Putty compositions based on cellulose nitrate as well as UF-PVAc was developed which finds wide application for surface repair of plywood. |
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m. Development of Adhesives for species refractory to bonding in plywood
manufacture |
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| Some species such as kapur, oily keruing and chilauni were found to pose problems bonding. To overcome this bonding problems a resin system based on phenol and formaldehyde has been developed and adhesive formulation has been optimised and the process parameters are worked out for achieving good bond strength . |
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| III Development of Resin adhesives for other wood based panels |
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| (a) |
Suitable PF resin for bonding Bamboo Mat based composites have been developed. Process parameters for mats dipping, moisture content, Assembly time and hot pressing schedules have been optimized. |
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| (b) |
Efficient resin system has been developed for bonding Rice husk particle boards. The process for making particles, resin application system, mat forming system have been worked out. The phenolic resin system developed is less expensive as they are based on naturally occurring phenolic materials. |
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| (c) |
Cardanol substituted phenolic resin was developed to bond chir pine needles particles. The process parameters like moisture content of glued particles. Assembly time, Mat formation and hot press schedules have been worked out to manufacture grade II chir pine needle particle board. |
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| LATEST ADHESIVES DEVELOPED |
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| (1) |
Development of phenolic resin system for bonding high moisture content veneers (14% - 16%) |
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| (2) |
Development of adhesives from Bio materials |
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| (3) |
Development of Amino resin system for particle board manufacture with less formaldehyde emission (Upgradation of laboratory studies to pilot scale) |
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| (4) |
Development of powder phenolic resin for the manufacture of bamboo mat based composites. |
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| (5) |
Studies on the use of surface coating on bamboo flooring tiles to enhance the abrasion resistance properties. |
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| (6) |
Development of low cost phenol formaldehyde resin (3 stage process) |
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| (7) |
Studies to optimize resin formulation to bond fibres of sesal for Acoustic purpose. |
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| (8) |
Detailed investigation on the treatment of battens and modified resin formulation to develop fire retardant flush door. |
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Optimisation of resin formulation for the manufacture of compregs and highly densified shuttering grade materials using Bamboo mat and plantation timbers. |
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| (10) |
Development of resin system for wood plastic bonding. |
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| (11) |
Development of isocyanate resins . |
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| (12) |
Activities are continued to effect improvements on existing resins, adhesives and process parameters for panel making. |
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